The NSF INCLUDES REM program for FuSe Interconnects: Enabling Transitions into the Microelectronic Ecosystem supplement is a direct result of the workforce development ideation workshop funded by the parent proposal Collaborative Research: FuSe: Interconnects with Co-Designed Materials, Topology, and Wire Architecture. On March 15th, 2024, the FuSe Workshop – Interconnecting the Next Generation Semiconductor Workforce from Thinkers to Doers to Innovators was held in Tucson, Arizona at the ECEDHA conference. Technical Research PIs and associated industry members worked together with 25 representatives from the *** Consortium (***) and *** Foundation (***) to ideate opportunities to engage students in the microelectronic ecosystem. The *** is a well-established network of core members from 21 Historically Black Colleges and Universities (HBCUs), Hispanic Serving Institutions (HSIs) and Tribal Colleges and Universities (TCUs), and 15 affiliate members from Predominantly White Institutions (PWIs), some of which are also HSIs. The *** is the student-facing arm of the *** with a Pathways to Success program that combines internship experiences with holistic, structured mentorship.
This NSF INCLUDES supplement funds results of the ideation workshop focused on increasing the microelectronic talent pool. The research plan intentionally positions engaging experiences at essential transition points throughout the microelectronic curriculum by embedding microelectronic-centered design opportunities in a collaborative cohort of students, academic mentors, industry mentors, and faculty at different locations. The experiences are co-designed, co-delivered educational modules from all stakeholders aimed at increasing the interconnection of personal interest, creativity, fundamental knowledge, and skills through the inspiration of design-based pedagogy. This effort will answer questions that affect the wide distribution of knowledge in the microelectronic field including: What is the minimum microelectronic and semiconductor practical skillset for undergraduate students to feel competent and confident before entering research or industrial experiences in the microelectronic area? How does this confidence in practical skills motivate deeper theoretical understanding? How do open-source (free or reduced price) design tools compare to proprietary software for creativity, system-level understanding, fundamental understanding, and industry readiness? What are the tradeoffs? How can co-curricular activities fulfill the above needs in a cheaper and more flexible way to widen participation at schools without resources to fabricate devices?
First year activities involving students, faculty and staff from several HBCUs, two PWIs, and multiple companies in a variety of activities, each of which will inform the planning and delivery of the activities that follow:
• Hybrid/Remote Multi-University Design Ideation Experiences for Faculty Mentors (Fall and Spring Semester)
• Faculty/Graduate Mentorship Training (Fall Semester)
• Hybrid/Remote Design Skills Development Workshops for Students (Between Fall and Spring Semester and after Spring Semester)
• Pre-Internship Experience University Cleanroom Training (Between Spring Semester and Summer)
• Internship within Microelectronic Ecosystem through Inclusive Engineering Foundation Pathways Program (Summer)
• Post-Internship Experience Peer Mentorship Training (End of Summer)
The full paper will be available to logged in and registered conference attendees once the conference starts on June 22, 2025, and to all visitors after the conference ends on June 25, 2025