2026 ASEE Annual Conference & Exposition

NSF INCLUDES: Collaborative Research: Advancing Semiconductor Education through Expansion and Diversification (ASEED)

Presented at NSF Grantees Poster Session II

The Chips & Science Act, primarily aimed at strengthening semiconductor production, also presents significant opportunities for workforce development. However, chip design is a highly complex process that requires not only advanced hardware and software facilities but also expertise spanning multiple STEM disciplines. Consequently, small institutions often face common challenges, including limited access to proper training, difficulties in maintaining costly facilities, and constraints in evaluating their community impact. If these challenges are not addressed, smaller institutions risk being left behind in future opportunities associated with the Chips & Science Act.

Importantly, these challenges cannot be effectively addressed by individual units or isolated local efforts; instead, they require coordinated, nationwide collaboration among institutions with similar needs. To collectively respond, three Historically Black Colleges and Universities (HBCUs) jointly launched the project entitled “Advancing Semiconductor Education through Expansion and Diversification (ASEED),” which aims to develop scalable solutions and raise national awareness of these barriers. The project is supported by the National Science Foundation’s Eddie Bernice Johnson INCLUDES program through the Division of Equity for Excellence in STEM with award number 2436203. This paper presents preliminary findings from the ongoing ASEED project.

Authors
  1. Zhigang Xiao Alabama A&M University
  2. LUJUN ZHAI Orcid 16x16http://orcid.org/0009-0003-6187-027X Prairie View A&M University
  3. Dr. Xiang Zhao Alabama A&M University [biography]
  4. Mubbashar Altaf Khan Central State University
Note

The full paper will be available to logged in and registered conference attendees once the conference starts on June 21, 2026, and to all visitors after the conference ends on June 24, 2026